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2026
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Red Copper Leads the Liquid-Cooling Thermal Revolution, with High-Precision Copper Strips Empowering AI Computing Centers
With the power consumption of a single GPU exceeding 1,000 W, data centers have fully entered the liquid-cooling era, and red copper (TP2 oxygen-free copper) has emerged as the core material for heat-dissipation substrates thanks to its ultra-high thermal conductivity of ≥390 W/(m·K). In 2026, demand for high-precision red-copper strips is expected to grow by 58% year on year, primarily for cold plates and immersion-cooling components. Companies such as Jintian Shares are accelerating the establishment of production bases in Vietnam and Thailand, with a newly commissioned 30,000-ton-per-year project for high-precision red-copper bars dedicated to liquid-cooling systems for new-energy vehicles and AI servers. It is projected that red-copper demand in the liquid-cooling sector will reach 45,000 tons in 2026, driving the overall high-end copper-material market to surpass RMB 18.6 billion.
With the power consumption of a single GPU exceeding 1,000 W, data centers have fully entered the liquid-cooling era, and red copper (TP2 oxygen-free copper) has emerged as the core material for heat-dissipation substrates thanks to its ultra-high thermal conductivity of ≥390 W/(m·K). In 2026, demand for high-precision red-copper strips is expected to grow by 58% year on year, primarily for cold plates and immersion-cooling components. Companies such as Jintian Shares are accelerating the establishment of production bases in Vietnam and Thailand, with a newly commissioned 30,000-ton-per-year project for high-precision red-copper bars dedicated to liquid-cooling systems for new-energy vehicles and AI servers. It is projected that red-copper demand in the liquid-cooling sector will reach 45,000 tons in 2026, driving the overall high-end copper-material market to exceed RMB 18.6 billion.